Integrated circuit and method of forming an integrated circuit

ABSTRACT

An IC structure includes a first cell and a first and second rail. The first cell includes a first and second active region and a first, a second and a third gate structure. The first active region having a first dopant type. The second active region having a second dopant type. The first gate structure extending in a second direction, overlapping the first or the second active region. The second gate structure extending in the second direction, and overlapping a first edge of the first or second active region. The third gate structure extending in the second direction, and overlapping at least a second edge of the first or second active region. The first rail extending in the first direction and overlapping a middle portion of the first active region. The second rail extending in the first direction and overlapping a middle portion of the second active region.

PRIORITY CLAIM

The present application is a continuation of U.S. application Ser. No. 16/538,297, filed Aug. 12, 2019, now U.S. Pat. No. 10,867,114, issued Dec. 15, 2020, which is a continuation of U.S. application Ser. No. 15/682,885, filed Aug. 22, 2017, now U.S. Pat. No. 10,380,315, issued Aug. 13, 2019, which claims the priority of U.S. Provisional Application No. 62/395,089, filed Sep. 15, 2016, which are incorporated herein by reference in their entireties.

BACKGROUND

The recent trend in miniaturizing integrated circuits (ICs) has resulted in smaller devices which consume less power yet provide more functionality at higher speeds. The miniaturization process has also resulted in stricter design and manufacturing specifications as well as reliability challenges. Various electronic design automation (EDA) tools generate, optimize and verify standard cell layout designs for integrated circuits while ensuring that the standard cell layout design and manufacturing specifications are met.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the following detailed description when read with the accompanying figures. It is noted that, in accordance with the standard practice in the industry, various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.

FIG. 1 is a diagram of a layout design of an IC structure, in accordance with some embodiments.

FIGS. 2A, 2B and 2C are diagrams of an IC structure, in accordance with some embodiments.

FIG. 3A is a diagram of a layout design of an IC structure, in accordance with some embodiments.

FIG. 3B is a diagram of a layout design of an IC structure, in accordance with some embodiments.

FIG. 3C is a diagram of a layout design of an IC structure, in accordance with some embodiments.

FIG. 4 is a diagram of a layout design of an IC structure, in accordance with some embodiments.

FIGS. 5A and 5B are diagrams of an IC structure, in accordance with some embodiments.

FIG. 6A is a diagram of a layout design of a portion of an IC structure, in accordance with some embodiments.

FIG. 6B is a diagram of a layout design of a portion of an IC structure, in accordance with some embodiments.

FIG. 7A is a diagram of a layout design of a portion of an IC structure, in accordance with some embodiments.

FIG. 7B is a diagram of a layout design of a portion of an IC structure, in accordance with some embodiments.

FIG. 7C is a diagram of a layout design of a portion of an IC structure, in accordance with some embodiments.

FIG. 7D is a diagram of a layout design of a portion of an IC structure, in accordance with some embodiments.

FIG. 8 is a flowchart of a method of forming an IC structure, in accordance with some embodiments.

FIG. 9A is a flowchart of a method of generating a cell layout pattern of an IC, in accordance with some embodiments.

FIG. 9B is a flowchart of a method of placing a cell layout pattern of an IC, in accordance with some embodiments.

FIG. 10 is a block diagram of a system of designing an IC layout design, in accordance with some embodiments.

DETAILED DESCRIPTION

The following disclosure provides different embodiments, or examples, for implementing features of the provided subject matter. Specific examples of components, materials, values, steps, arrangements, or the like, are described below to simplify the present disclosure. These are, of course, merely examples and are not limiting. Other components, materials, values, steps, arrangements, or the like, are contemplated. For example, the formation of a first feature over or on a second feature in the description that follows may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features may be formed between the first and second features, such that the first and second features may not be in direct contact. In addition, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,” “above,” “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The apparatus may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may likewise be interpreted accordingly.

In accordance with some embodiments, an IC structure includes a first standard cell, a first rail and a second rail. The first standard cell includes a first active region, a second active region and a first gate structure. The first active region extends in a first direction and is located at a first level. The second active region extends in the first direction, is located at the first level, and is separated from the first active region in a second direction different from the first direction. The first gate structure extends in the second direction, overlaps the first active region and the second active region, and is located at a second level different from the first level.

The first rail extends in the first direction, overlaps the first active region, is configured to supply a first supply voltage, and is located at a third level different from the first level and the second level. The second rail extends in the first direction, overlaps the second active region, is located at the third level, is separated from the first rail in the second direction, and is configured to supply a second supply voltage different from the first supply voltage.

In some embodiments, a center of the first rail is aligned in the first direction with a center of the first active region. In some embodiments, a center of the second rail is aligned in the first direction with a center of the second active region. In some embodiments, the first active region is a p-type metal oxide semiconductor (PMOS) region, and the second active region is n-type metal oxide semiconductor (NMOS) region.

In some embodiments, in comparison with other approaches, the first active region and the second active region provide a larger area resulting in better speed performance and lower resistance.

FIG. 1 is a diagram of a layout design 100 of an IC structure, in accordance with some embodiments.

Layout design 100 includes a first region 102 between a second region 104 and a third region 106. First region 102 is adjacent to second region 104 and third region 106. First region 102 is on a same layout level as one or more of second region 104 or third region 106.

First region 102 includes a shallow trench isolation (STI) layout pattern 102 a between second region 104 and third region 106. STI layout pattern 102 a is usable to manufacture a corresponding STI structure 208 (shown in FIGS. 2A-2C) of an IC structure 200.

STI layout pattern 102 a extends in a first direction X, and has a width W1 in a second direction Y different from the first direction X. In some embodiments, a center of STI layout pattern 102 a is a center of layout design 100.

Second region 104 includes a first active region layout pattern 104 a and an STI layout pattern 104 b.

First active region layout pattern 104 a extends in the first direction X, and has a width W1 a in the second direction Y. First active region layout pattern 104 a is usable to manufacture a corresponding first active region 204 a (shown in FIGS. 2A-2C) of IC structure 200. A side of first active region layout pattern 104 a is aligned with a side of STI layout pattern 104 b along gridline 126 a. A side of first active region layout pattern 104 a is aligned with a side of STI layout pattern 102 a along gridline 126 b.

STI layout pattern 104 b extends in first direction X and has a width W2 a in second direction Y. A side of STI layout pattern 104 b is aligned with a side 130 a of layout design 100 in the first direction X.

Third region 106 includes a second active region layout pattern 106 a and an STI layout pattern 106 b.

Second active region layout pattern 106 a extends in the first direction X, and has a width W1 b in the second direction Y. Second active region layout pattern 106 a is usable to manufacture a corresponding second active region 206 a (shown in FIGS. 2A-2C) of IC structure 200. A side of second active region layout pattern 106 a is aligned with a side of STI layout pattern 106 b along gridline 128 b. A side of second active region layout pattern 106 a is aligned with a side of STI layout pattern 102 a along gridline 128 a. STI layout pattern 102 a is between first active region layout pattern 104 a and second active region layout pattern 106 a. First active region layout pattern 104 a or second active region layout pattern 106 a is on a first layout level of layout design 100. Other configurations in the first active region layout pattern 104 a and second active region layout pattern 106 a are within the scope of the present disclosure.

STI layout pattern 106 b extends in first direction X and has a width W2 b in second direction Y. A side of STI layout pattern 106 b is aligned with a side 130 b of layout design 100. The side 130 b of layout design 100 is an opposite side of layout design 100 from the side 130 a of layout design 100. In some embodiments, a center of STI layout pattern 104 b or 106 b is aligned in the second direction Y with a center of layout design 100.

One or more of STI layout pattern 102 a, 104 b or 106 b is on a second layout level of layout design 100. Second layout level of layout design 100 is different from first layout level. In some embodiments, the second layout level is above the first layout level. In some embodiments, the second layout level is below the first layout level.

Other configurations in STI layout pattern 102 a, 104 b or 106 b are within the scope of the present disclosure.

In some embodiments, a width of widths W1, W1 a, W1 b, W2 a, W2 b, W4 a (shown in FIG. 3A) or W4 b (shown in FIG. 3A) is the same as a different width of widths W1, W1 a, W1 b, W2 a or W2 b. In some embodiments, a width of widths W1, W1 a, W1 b, W2 a, W2 b, W4 a (shown in FIG. 3A) or W4 b (shown in FIG. 3A) differs from a different width of widths W1, W1 a, W1 b, W2 a, W2 b, W4 a (shown in FIG. 3A) or W4 b (shown in FIG. 3A).

Layout design 100 further includes one or more fin layout patterns 110 a, 110 b, . . . , 110 f (hereinafter referred to as a “first set of fin layout patterns 110”) each extending in first direction X, and being over the first active region layout pattern 104 a. Each of the layout patterns of the first set of fin layout patterns 110 is separated from an adjacent layout pattern of the first set of fin layout patterns 110 in the second direction Y by a fin pitch P1. The first set of fin layout patterns 110 is usable to manufacture a corresponding first set of fins 210 (shown in FIGS. 2A-2C) of IC structure 200. Other configurations or quantities of fins in the first set of fin layout patterns 110 are within the scope of the present disclosure.

Layout design 100 further includes one or more fin layout patterns 112 a, 112 b, . . . , 112 f (hereinafter referred to as a “second set of fin layout patterns 112”) each extending in first direction X, and being over the second active region layout pattern 106 a. Each of the layout patterns of the second set of fin layout patterns 112 is separated from an adjacent layout pattern of the second set of fin layout patterns 112 in the second direction Y by a fin pitch P2. The fin pitch P2 is the same as the fin pitch P1. In some embodiments, at least one fin pitch P2 between a pair of adjacent layout patterns of the second set of fin layout patterns 112 is different from fin pitch P1 between a pair of adjacent layout patterns of the first set of fin layout patterns 110. The second set of fin layout patterns 112 is usable to manufacture a corresponding second set of fins 212 (shown in FIGS. 2A-2C) of IC structure 200. Other configurations or quantities in the second set of fin layout patterns 112 are within the scope of the present disclosure.

At least the first set of fin layout patterns 110 or the second set of fin layout patterns 110 is on the second layout level of layout design 100. In some embodiments, first set of fin layout patterns 110 or second set of fin layout patterns 110 is on a layout level of layout design 100 different from the second layout level.

Layout design 100 further includes a first gate layout pattern 114 extending in the second direction Y, and overlapping the first set of fin layout patterns 110 and the second set of fin layout patterns 112. First gate layout pattern 114 is usable to manufacture a corresponding first gate structure 214 (shown in FIGS. 2A-2C) of IC structure 200. In some embodiments, a center of the first gate layout pattern 114 is aligned in the second direction Y with the center of STI layout pattern 104 b, 106 b or the center of layout design 100. The first set of fin layout patterns 110 and the second set of fin layout patterns 112 are below the first gate layout pattern 114. Other configurations in first gate layout pattern 114 are within the scope of the present disclosure.

First gate layout pattern 114 is on a third layout level different from the first layout level and the second layout level. In some embodiments, the third layout level is above one or more of the first or second layout level. In some embodiments, the third layout level is below one or more of the first or second layout level.

Layout design 100 further includes a first dummy gate layout pattern 116 a and a second dummy gate layout pattern 116 b.

First dummy gate layout pattern 116 a extends in the second direction Y, and is over a third side 124 a of layout design 100. The first dummy gate layout pattern 116 a is usable to manufacture a corresponding first dummy gate structure 216 a (shown in FIGS. 2A-2C) of IC structure 200. In some embodiments, a center of the first dummy gate layout pattern 116 a is aligned in the second direction Y with the third side 124 a of layout design 100. In some embodiments, first dummy gate layout pattern 116 a is a continuous polysilicon on oxide diffusion (OD) edge (CPODE) layout pattern. Other configurations in first dummy gate layout pattern 116 a are within the scope of the present disclosure.

Second dummy gate layout pattern 116 b extends in the second direction Y, and is over a fourth side 124 b of layout design 100. The fourth side 124 b of layout design 100 is an opposite side of layout design 100 from the third side 124 a of layout design 100. The second dummy gate layout pattern 116 b is usable to manufacture a corresponding second dummy gate structure 216 b (shown in FIGS. 2A-2C) of IC structure 200. In some embodiments, a center of the second dummy gate layout pattern 116 b is aligned in the second direction Y with the fourth side 124 b of layout design 100. In some embodiments, second dummy gate layout pattern 116 b is a CPODE layout pattern. Other configurations in second dummy gate layout pattern 116 b are within the scope of the present disclosure. In some embodiments, at least one of first dummy gate layout pattern 116 a or second dummy gate layout pattern 116 b is a discontinuous set of dummy gate patterns (e.g., as shown in FIGS. 3A and 6B) extending in the second direction Y, and being spaced from each other in the second direction Y. In some embodiments, first dummy gate layout pattern 116 a overlaps the third side 124 a of layout design 100. In some embodiments, second dummy gate layout pattern 116 b overlaps the fourth side 124 b of layout design 100.

In some embodiments, second dummy gate layout pattern 116 b is a CPODE layout pattern.

First dummy gate layout pattern 116 a or second dummy gate layout pattern 116 b is on the third layout level.

Layout design 100 further includes a first rail layout pattern 118 a and a second rail layout pattern 118 b.

First rail layout pattern 118 a extends in the first direction X and overlaps the first active region layout pattern 104 a. First rail layout pattern 118 a is usable to manufacture a corresponding first rail 218 a (shown in FIGS. 2A-2C) of IC structure 200. The first rail 218 a is configured to supply a first supply voltage VDD. In some embodiments, the first rail 218 a is configured to supply a second supply voltage VSS different from the first supply voltage VDD. First rail layout pattern 118 a overlaps the third side 124 a and the fourth side 124 b of layout design 100. First rail layout pattern 118 a is over a center 120 a of the first active region layout pattern 104 a. In some embodiments, first rail layout pattern 118 a is over fin layout patterns 110 c and 110 d. In some embodiments, a center 120 b of first rail layout pattern 118 a is aligned in the first direction X with the center 120 a of first active region layout pattern 104 a.

Second rail layout pattern 118 b extends in the first direction X and overlaps the second active region layout pattern 106 a. Second rail layout pattern 118 b is separated from the first rail layout pattern 118 a in the second direction Y. Second rail layout pattern 118 b is usable to manufacture a corresponding second rail 218 b (shown in FIGS. 2A-2C) of IC structure 200. The second rail 218 b is configured to supply the second supply voltage VSS. In some embodiments, the second rail 218 b is configured to supply the first supply voltage VDD. Second rail layout pattern 118 b overlaps the third side 124 a and the fourth side 124 b of layout design 100. Second rail layout pattern 118 b is over a center 122 a of the second active region layout pattern 106 a. In some embodiments, second rail layout pattern 118 b is over fin layout patterns 112 c and 112 d. In some embodiments, a center 122 b of second rail layout pattern 118 b is aligned in the first direction X with the center 122 a of second active region layout pattern 106 a. Other configurations of first rail layout pattern 118 a or second rail layout pattern 118 b are within the scope of the present disclosure.

First rail layout pattern 118 a or second rail layout pattern 118 b is on a fourth layout level different from the first layout level, the second layout level and the third layout level. In some embodiments, the fourth layout level is above one or more of the first, second or third layout level. In some embodiments, the fourth layout level is below one or more of the first, second or third layout level.

Layout design 100 further includes a set of via layout patterns 132 a, 132 b, and 132 c. Set of via layout patterns 132 a, 132 b and 132 c are over the first gate layout pattern 114. Set of via layout patterns 132 a, 132 b and 132 c are usable to manufacture a corresponding set of vias 220 a, 220 b and 220 c (shown in FIGS. 2A-2C) of IC structure 200. In some embodiments, a center of one or more via layout patterns of the set of via layout patterns 132 a, 132 b or 132 c is over a center of the first gate layout pattern 114 or layout design 100. In some embodiments, the center of a via layout pattern of the set of via layout patterns 132 a, 132 b or 132 c is aligned in the second direction Y with another via layout pattern of the set of via layout patterns 132 a, 132 b or 132 c. Other configurations of via layout patterns 132 a, 132 b or 132 c are within the scope of the present disclosure.

In some embodiments, layout design 100 is a standard cell 101 of an IC structure. Standard cell 101 has a width (not shown) in first direction X, and a height H1 in second direction Y. In some embodiments, standard cell 101 is a logic gate cell. In some embodiments, a logic gate cell includes an AND, OR, NAND, NOR, XOR, INV, AND-OR-Invert (AOI), OR-AND-Invert (OAI), MUX, Flip-flop, BUFF, Latch, delay, clock cells, or the like. In some embodiments, a standard cell is a memory cell. In some embodiments, a memory cell includes a static random access memory (SRAM), a dynamic RAM (DRAM), a resistive RAM (RRAM), a magnetoresistive RAM (MRAM) read only memory (ROM), or the like. In some embodiments, a standard cell includes one or more active or passive elements. Examples of active elements include, but are not limited to, transistors and diodes. Examples of transistors include, but are not limited to, metal oxide semiconductor field effect transistors (MOSFET), complementary metal oxide semiconductor (CMOS) transistors, bipolar junction transistors (BJT), high voltage transistors, high frequency transistors, p-channel and/or n-channel field effect transistors (PFETs/NFETs), etc.), FinFETs, planar MOS transistors with raised source/drain, or the like. Examples of passive elements include, but are not limited to, capacitors, inductors, fuses, resistors, or the like. Standard cell 101 includes other features not shown for ease of illustration.

In some embodiments, first rail layout pattern 118 a or second rail layout pattern 118 b are part of standard cell 101, 301A-301C, 401, 701A-701D or array 601. In some embodiments, first rail layout pattern 118 a or second rail layout pattern 118 b are not part of standard cell 101, 301A-301C, 401, 601, 701A-701D or array 601.

In some embodiments, at least via layout pattern 132 a, 132 b, 132 c, first dummy gate layout pattern 116 a or the second dummy gate layout pattern 116 b is part of standard cell 101, 301A-301C, 401, 701A-701D or array 601. In some embodiments, at least via layout pattern 132 a, 132 b, 132 c, first dummy gate layout pattern 116 a or the second dummy gate layout pattern 116 b is not part of standard cell 101, 301A-301C, 401, 701A-701D or array 601.

First rail layout pattern 118 a and second rail layout pattern 118 b are inbound power layout patterns. In some embodiments, an inbound power layout pattern is a power layout pattern that does not overlap an edge of standard cell 101. In some embodiments, an outbound power layout pattern is a power layout pattern that overlaps an edge of standard cell 101.

In some embodiments, the first active region layout pattern 104 a and the second active region layout pattern 106 a have a larger area than other approaches. As the area of the first active region layout pattern 106 a and second active area layout pattern 106 a is increased, the corresponding active region (first active region 204 a and second active region 206 a) of IC structure 200 manufactured by layout design 100 is increased, resulting in a layout design and a corresponding IC structure (e.g., IC structure 200) with increased speed performance and power performance compared to other approaches.

In some embodiments, by the first rail layout pattern 118 a or the second rail layout pattern 118 b being inbound power rail layout patterns, a distance in the second direction Y between the first rail layout pattern 118 a or the second rail layout pattern 118 b and the corresponding first active region layout pattern 104 a or second active region layout pattern 106 a is smaller than outbound power rail layout patterns, and results in a layout design 100 that is used to manufacture an IC structure 200 with lower resistance, and faster speed than other approaches.

FIGS. 2A, 2B and 2C are diagrams of an IC structure 200, in accordance with some embodiments. FIG. 2A is a cross-sectional view of IC structure 200 corresponding to layout design 100 as intersected by plane A-A′, FIG. 2B is a cross-sectional view of IC structure 200 corresponding to layout design 100 as intersected by plane B-B′, and FIG. 2C is a cross-sectional view of IC structure 200 corresponding to layout design 100 as intersected by plane C-C′, in accordance with some embodiments. IC structure 200 is manufactured by layout design 100.

Structural relationships and configurations of IC structure 200 are similar to the structural relationships and configurations of layout design 100 of FIG. 1 , and will not be described in FIGS. 2A-2C for brevity.

IC structure 200 includes a first active region 204 a, a second active region 206 a and an intermediary region 207.

First active region 204 a is on a first level of IC structure 200. First active region 204 a represents a source and/or drain diffusion portion of at least one transistor having a first dopant type. The first dopant type is a p-dopant type. In some embodiments, the at least one transistor includes at least one p-type metal oxide semiconductor (PMOS) transistor, and the first active region 204 a is the source or drain portion of the at least one PMOS transistor in IC structure 200. In some embodiments, the first dopant type is an n-dopant type, the at least one transistor includes at least one n-type metal oxide semiconductor (NMOS) transistor, and the first active region 204 a is the source or drain portion of the at least one NMOS transistor in IC structure 200. First active region 204 a and second active region 206 a are connected by intermediary region 207.

Second active region 206 a is on the first level of IC structure 200. Second active region 206 a represents a source or drain diffusion portion of at least one transistor having a second dopant type. The second dopant type is an n-dopant type. In some embodiments, the at least one transistor includes at least one NMOS transistor, and the second active region 206 a is the source or drain portion of the at least one NMOS transistor in IC structure 200. In some embodiments, the second dopant type is a p-dopant type, and the at least one transistor includes at least one PMOS transistor, and the second active region 206 a is the source or drain portion of the at least one PMOS transistor in IC structure 200. In some embodiments, first active region 204 a or second active region 206 a is referred to as an oxide-definition (OD) region of IC structure 200 which defines the source or drain diffusion regions of IC structure 200. In some embodiments, the first dopant type of the first active region 204 a is different from the second dopant type of the second active region 206 a. For example, in some embodiments, if the first dopant type of the first active region 204 a is an n-dopant type, then the second dopant type of the second active region 206 a is a p-dopant type, and IC structure 200 is referred to as an NNPP structure. For example, in some embodiments, if the first dopant type of the first active region 204 a is a p-dopant type, then the second dopant type of the second active region 206 a is an n-dopant type, and IC structure 200 is referred to as an PPNN structure.

Intermediary region 207 is on the first level of IC structure 200. Intermediary region 207 is between second active region 206 a and first active region 204 a. In some embodiments, one or more of first active region 204 a, second active region 206 a or intermediary region 207 is a portion of a substrate (not shown). Other configurations of first active region 204 a, second active region 206 a or intermediary region 207 are within the scope of the present disclosure.

IC structure 200 further includes a first set of fins 210 and a second set of fins 212 extending in the first direction X. Each fin of the first set of fins 210 is separated from an adjacent fin of the first set of fins 210 by STI 208. In some embodiments, the first set of fins 210 is part of the first active region 204 a and has the first dopant-type. Each fin of the second set of fins 212 is separated from an adjacent fin of the second set of fins 212 by STI 208. In some embodiments, the second set of fins 212 is part of the second active region 206 a and has the second dopant-type. Other configurations of first set of fins 210 or second set of fins 212 are within the scope of the present disclosure.

IC structure 200 further includes STI 208, STI 204 b, STI 206 b and STI 240. One or more of STI 208, STI 204 b, STI 206 b and STI 240 is on a second level of IC structure 200. The second level of IC structure 200 is above the first level of IC structure 200.

STI 208 separates the first set of fins 210 from the second set of fins 212. In some embodiments, STI 208 separates the first active region 204 a and the second active region 206 a.

STI 204 b separates IC structure 200 or first set of fins 210 from other structures (not shown).

STI 206 b separates IC structure 200 or second set of fins 212 from adjacent structures (not shown). In some embodiments, one or more of STI 208, STI 204 b, STI 206 b and STI 240 is a dielectric material. Other configurations of STI 208, STI 204 b, STI 206 b or STI 240 are within the scope of the present disclosure.

IC structure 200 further includes a first gate structure 214 overlapping at least the first set of fins 210, the second set of fins 212, STI 208, STI 204 b or STI 206 b. First gate structure 214 is on a third level of IC structure 200. The third level of IC structure 200 is above the first level and the second level of IC structure 200. In some embodiments, first gate structure 214 is polysilicon. In some embodiments, at least the first set of fins 210 or the second set of fins 212 is embedded within the first gate structure 214. Other configurations of first gate structure 214 are within the scope of the present disclosure.

IC structure 200 further includes a first dummy gate structure 216 a and a second dummy gate structure 216 b positioned on opposite sides of IC structure 200 from each other. First dummy gate structure 216 a and a second dummy gate structure 216 b is on the third level of IC structure 200. In some embodiments, first dummy gate structure 216 a or second dummy gate structure 216 b is polysilicon. First dummy gate structure 216 a and second dummy gate structure 216 b are referred to as a CPODE structure. First dummy gate structure 216 a overlaps a first side 224 a of IC structure 200. Second dummy gate structure 216 b overlaps a second side 224 b opposite of the first side 224 a of IC structure 200. In some embodiments, at least first dummy gate structure 216 a or second dummy gate structure 216 b are configured to separate IC structure 200 from other IC structures (not shown). IC structure 200 is an IC of a standard cell 201.

IC structure 200 further includes a first rail 218 a and a second rail 218 b on a fourth level of IC structure 200. The fourth level of IC structure 200 is above the first level, the second level and the third level of IC structure 200. In some embodiments the fourth level is a metal-one (M1) layer of IC structure 200.

First rail 218 a overlaps the first active region 204 a. In some embodiments, first rail 218 a overlaps a center of the first active region 204 a. First rail 218 a is configured to supply the first supply voltage VDD. In some embodiments, first rail to 218 a is configured to supply the second supply voltage VSS. First rail 218 a does not overlap a third side 230 a of IC structure 200.

Second rail 218 b overlaps the second active region 206 a. In some embodiments, second rail 218 b overlaps a center of the first active region 204 a. Second rail 218 b is configured to supply the second supply voltage VSS. In some embodiments, second rail 218 b is configured to supply the first supply voltage VDD. Second rail 218 b does not overlap a fourth side 230 b of IC structure 200 opposite of the third side 230 a of IC structure 200. In some embodiments, first rail 218 a or second rail 218 b is on the M1 layer of IC structure 200. In some embodiments, at least one member of the first rail 218 a or the second rail 218 b is a conductive material including copper, aluminum, alloys thereof or other suitable conductive materials, that is formed in one or more metallization layers by one or more of a physical vapor deposition process, a chemical vapor deposition process, a plating process, or other suitable processes. Other configurations of first rail 218 a or second rail 218 b are within the scope of the present disclosure.

In some embodiments, first rail 218 a or second rail 218 b is part of standard cell 201 or 501. In some embodiments, first rail 218 a or second rail 218 b is not part of standard cell 201 or 501.

IC structure 200 further includes a set of vias 220 a, 220 b and 220 c over first gate structure 214. The set of vias 220 a, 220 b and 220 c are electrically coupled to the first gate structure 214, and are configured to provide an electrical connection to other layers (not shown). In some embodiments, at least one via of the set of vias 220 a, 220 b or 220 c is over a center of the first gate structure 214. In some embodiments, the set of vias 220 a, 220 b and 220 c are on a VO layer of IC structure 200. In some embodiments, at least one via of the set of vias 220 a, 220 b or 220 c is a metal line, a via, a through silicon via (TSV), an inter-level via (ILV), a slot via, an array of vias, or another suitable conductive line. In some embodiments, at least one via of the set of vias 220 a, 220 b or 220 c includes copper, aluminum, nickel, titanium, tungsten, cobalt, carbon, alloys thereof or another suitable conductive material, that is formed in one or more metallization layers by one or more of a physical vapor deposition process, a chemical vapor deposition process, a plating process, or other suitable processes. In some embodiments, at least one via of the set of vias 220 a, 220 b or 220 c includes one or more conductive line portions. Other configurations, materials or quantities of the set of vias 220 a, 220 b and 220 c are within the scope of the present disclosure.

In some embodiments, at least via 220 a, 220 b or 220 c is part of standard cell 201 or 501. In some embodiments, at least via 220 a, 220 b is 220 c is not part of standard cell 201 or 501. In some embodiments, at least the first dummy gate structure 216 a or the second dummy gate structure 216 b is part of standard cell 201 or 501. In some embodiments, at least the first dummy gate structure 216 a or the second dummy gate structure 216 b is not part of standard cell 201 or 501.

In some embodiments, the first, second, third or fourth level is used interchangeably with the corresponding first, second, third or fourth layer of the IC structure 200 or 500.

IC structure 200 includes other levels or layers where elements are not shown for clarity of the present disclosure. In some embodiments, the first active region 204 a and the second active region 206 a have a larger area than other approaches. As the area of the first active region and second active region 206 a of IC structure 200 is increased, IC structure 200 has increased speed performance and power performance compared to other approaches.

FIG. 3A is a layout design 300A of an IC structure, in accordance with some embodiments. Layout design 300A is a layout design of a multi-gate IC structure (not shown). Components that are the same or similar to those in each of FIGS. 1, 2A-2C, 3A-3C, 4, 5A-5B, 6A-6B and 7A-7D are given the same reference numbers, and detailed description thereof is thus omitted.

Layout design 300A is a variation of layout design 100 of FIG. 1 . In comparison with layout design 100 of FIG. 1 , layout design 300A further includes a second gate layout pattern 314 a and a third gate layout pattern 314B, and dummy gate layout patterns 140 a, 140 b and 140 c replace first dummy gate layout pattern 116 a, and dummy gate layout patterns 142 a, 142 b and 142 c replace second dummy gate layout pattern 116 b.

For ease of illustration, the first set of fin layout patterns 110 and the second set of fin layout patterns 112 in FIG. 1 are not shown in FIGS. 3A-3C, 4, 6B and 7A-7D.

Second gate layout pattern 314 a and third gate layout pattern 314 b are similar to first gate layout pattern 114, and detailed description is therefore omitted.

Dummy gate layout patterns 140 a, 140 b and 140 c are similar to first dummy gate layout pattern 116 a, and dummy gate layout patterns 142 a, 142 b and 142 c are similar to second dummy gate layout pattern 116 b, and detailed description is therefore omitted.

Second gate layout pattern 314 a and third gate layout pattern 314 b extend in the second direction Y, and overlap at least the first active region layout pattern 104 a, second active region layout pattern 106 a, STI layout pattern 102 a, STI layout pattern 104 b, STI layout pattern 106 b, first set of fin layout patterns 110 or the second set of fin layout patterns 112. Second or third gate layout pattern 314 a or 314 b is usable to manufacture a corresponding second or third gate structure (not shown) of IC structure 200.

First gate layout pattern 114 is between the second gate layout pattern 314 a and the third gate layout pattern 314 b.

Each gate layout pattern of the first gate layout pattern 114, the second gate layout pattern 314 a or the third gate layout pattern 314 b is separated from an adjacent gate layout pattern of the first gate layout pattern 114, the second gate layout pattern 314 a or the third gate layout pattern 314 b by a pitch P3.

Second gate layout pattern 314 a is separated from dummy gate layout patterns 140 a, 140 b and 140 c in the first direction X by a pitch P3′. Third gate layout pattern 314 b is separated from dummy gate layout patterns 142 a, 142 b and 142 c in the first direction X by a pitch P3′. In some embodiments, pitch P3 is the same as pitch P3′. In some embodiments, pitch P3 differs from pitch P3′.

Dummy gate layout pattern 140 a or 142 a is separated from corresponding dummy gate layout pattern 140 b or 142 b by a distance D1 a. Dummy gate layout pattern 140 b or 142 b is separated from corresponding dummy gate layout pattern 140 c or 142 c by a distance D1 b. First rail layout pattern 118 a and second rail layout pattern 118 b have a corresponding width W4 a and W4 b in in the second direction Y. In some embodiments, a width of widths W4 a, W4 b or a distance of distances D1 a, D1 b is the same as a different width of widths W4 a, W4 b or a different distance of distances D1 a, D1 b. In some embodiments, a width of widths W4 a, W4 b or a distance of distances D1 a, D1 b is differs from a different width of widths W4 a, W4 b or a different distance of distances D1 a, D1 b.

Layout design 300A has a length L1 in the first direction X. In some embodiments, length L1 is increased to accommodate a greater number of gate layout patterns. As the number of gate layout patterns 114, 314 a, 314 b is increased in layout design 300A, the speed of IC structure is increased and power performance of IC structure is improved compared to other designs. Other configurations or numbers of gate layout patterns or dummy gate layout patterns are within the scope of the present disclosure.

FIG. 3B is a layout design 300B of an IC structure, in accordance with some embodiments.

Layout design 300B is a variation of layout design 100 of FIG. 1 . In comparison with layout design 100 of FIG. 1 , a first active region layout pattern 304 a of layout design 300B replaces the first active region layout pattern 104 a of FIG. 1 , and an STI layout pattern 304 b of layout design 300B replaces STI layout pattern 104 b of FIG. 1 .

First active region layout pattern 304 a is similar to first active region layout pattern 104 a, STI layout pattern 304 b is similar to STI layout pattern 104 b, and similar detailed description of either layout pattern is therefore omitted.

First active region layout pattern 304 a is usable to manufacture a corresponding first active region (not shown) of IC structure 200, and STI layout pattern 304 b is usable to manufacture a corresponding STI (not shown) of IC structure 200.

First active region layout pattern 304 a has a width W1 a′ in the second direction Y. Width W1 a′ of first active region layout pattern 304 a is different from width W1 a of first active region layout pattern 104 a of FIG. 1 or width W1 b of second active region layout pattern 106 a.

A center 120 a of first active region layout pattern 304 a is offset or shifted from a center 120 b of first rail layout pattern 118 a by a distance D2. In other words, the center 120 a of first active region layout pattern 304 a is not aligned with a center 120 b of first rail layout pattern 118 a. In some embodiments, first rail layout pattern 118 a does not overlap first active region layout pattern 304 a. In some embodiments, first rail layout pattern 118 a overlaps a portion of first active region layout pattern 304 a.

STI layout pattern 304 b has a width W2 a′ in the second direction Y. Width W2 a′ of STI layout pattern 304 b is different from width W2 a of STI layout pattern 104 b of FIG. 1 or width W2 b of STI layout pattern 106 b. A center 150 b of STI layout pattern 304 b is shifted from a center 150 a of STI layout pattern 104 b of FIG. 1 by a distance D2′. In some embodiments, the center 150 b of STI layout pattern 304 b is not aligned with the center 120 b of first rail layout pattern 118 a. In some embodiments, the center 150 b of STI layout pattern 304 b is aligned with the center 120 b of first rail layout pattern 118 a. In some embodiments, first rail layout pattern 118 a overlaps STI layout pattern 304 b.

In some embodiments, a width of widths W1, W1 a′, W2 a′, W2 b, W4 a (shown in FIG. 3A) or W4 b (shown in FIG. 3A) or a distance of distances D2 or D2′ is the same as a different width of widths W1, W1 a′, W2 a′, W2 b, W4 a (shown in FIG. 3A) or a different distance of distances D2 or D2′. In some embodiments, a width of widths W1, W1 a′, W2 a′, W2 b, W4 a (shown in FIG. 3A) or W4 b (shown in FIG. 3A) or a distance of distances D2 or D2′ differs from a different width of widths W1, W1 a′, W2 a′, W2 b, W4 a (shown in FIG. 3A) or a different distance of distances D2 or D2′.

FIG. 3C is a layout design 300C of an IC structure, in accordance with some embodiments.

Layout design 300C is a variation of layout design 100 of FIG. 1 . In comparison with layout design 100 of FIG. 1 , a second active region layout pattern 306 a of layout design 300C replaces the second active region layout pattern 106 a of FIG. 1 , and an STI layout pattern 306 b of layout design 300C replaces the STI layout pattern 106 b of FIG. 1 .

Second active region layout pattern 306 a is similar to second active region layout pattern 106 a, STI layout pattern 306 b is similar to STI layout pattern 106 b, and similar detailed description of either layout pattern is therefore omitted.

Second active region layout pattern 306 a is usable to manufacture a corresponding second active region (not shown) of IC structure 200, and STI layout pattern 306 b is usable to manufacture a corresponding STI (not shown) of IC structure 200.

Second active region layout pattern 306 a has a width W1 b′ in the second direction Y. Width W1 b′ of second active region layout pattern 306 a is different from width W1 b of second active region layout pattern 106 a of FIG. 1 or width W1 a of first active region layout pattern 104 a.

A center 122 a of second active region layout pattern 306 a is offset or shifted from a center 122 b of second rail layout pattern 118 b by a distance D3. In other words, the center 122 a of second active region layout pattern 306 a is not aligned with the center 122 b of second rail layout pattern 118 b. In some embodiments, second rail layout pattern 118 b does not overlap second active region layout pattern 306 a. In some embodiments, first rail layout pattern 118 a overlaps a portion of second active region layout pattern 306 a.

STI layout pattern 306 b has a width W2 b′ in the second direction Y. Width W2 b′ of STI layout pattern 306 b is different from width W2 b of STI layout pattern 106 b of FIG. 1 or width W2 a of STI layout pattern 104 b. A center 152 b of STI layout pattern 306 b is shifted from a center 152 a of STI layout pattern 106 b of FIG. 1 by a distance D3′. In some embodiments, the center 152 b of STI layout pattern 306 b is not aligned with the center 122 b of second rail layout pattern 118 b. In some embodiments, the center 152 b of STI layout pattern 306 b is aligned with the center 122 b of second rail layout pattern 118 b. In some embodiments, second rail layout pattern 118 b overlaps STI layout pattern 306 b. In some embodiments, distance D3′ is the same as distance D3. In some embodiments, distance D3′ is different from distance D3.

In some embodiments, a width of widths W1, W1 a, W1 b′, W2 a, W2 b′, W4 a (shown in FIG. 3A) or W4 b (shown in FIG. 3A) or a distance of distances D3 or D3′ is the same as a different width of widths W1, W1 a, W1 b′, W2 a, W2 b′, W4 a (shown in FIG. 3A) or a different distance of distances D3 or D3′. In some embodiments, a width of widths W1, W1 a, W1 b′, W2 a, W2 b′, W4 a (shown in FIG. 3A) or W4 b (shown in FIG. 3A) or a distance of distances D3 or D3′ differs from a different width of widths W1, W1 a, W1 b′, W2 a, W2 b′, W4 a (shown in FIG. 3A) or a different distance of distances D3 or D3′. In some embodiments, the first active region layout pattern 104 a and the second active region layout pattern 106 a have a larger area than other approaches. As the area of the first active region layout pattern 106 a and second active area layout pattern 106 a is increased, the corresponding active region (first active region 204 a and second active region 206 a) of IC structure 200 manufactured by layout design 100 is increased, resulting in a layout design and a corresponding IC structure (e.g., IC structure 200) with increased speed performance and power performance compared to other approaches.

FIG. 4 is a diagram of a layout design 400 of an IC structure, in accordance with some embodiments.

Layout design 400 is a variation of layout design 100 of FIG. 1 . In comparison with layout design 100 of FIG. 1 , a standard cell 401 of layout design 400 replaces standard cell 101 of FIG. 1 , a first active region layout pattern 404 a of layout design 400 replaces the first active region layout pattern 104 a of FIG. 1 , an STI layout pattern 404 b of layout design 400 replaces STI layout pattern 104 b, a second active region layout pattern 406 a of layout design 400 replaces the second active region layout pattern 106 a of FIG. 1 , an STI layout pattern 406 b of layout design 400 replaces the STI layout pattern 106 b of FIG. 1 , a first set of fin layout patterns 410 of layout design 400 replaces the first set of fin layout patterns 110 of FIG. 1 and a second set of fin layout patterns 412 of layout design 400 replaces the second set of fin layout patterns 112 of FIG. 1 .

First active region layout pattern 404 a is similar to first active region layout pattern 104 a, second active region layout pattern 406 a is similar to second active region layout pattern 106 a, STI layout patterns 404 b and 406 b are similar to corresponding STI layout patterns 104 b and 106 b, first set of fin layout patterns 410 is similar to first set of fin layout patterns 110, second set of fin layout patterns 412 is similar to second set of fin layout patterns 112, and similar detailed description of these layout patterns is therefore omitted.

Standard cell 401 is similar to standard cell 101, and has a height H2. Height H2 of standard cell 401 differs from height H1 of standard cell 101. In some embodiments, height H1 is twice that of height H2. In other words, in some embodiments, height H2 is half of height H1. In some embodiments, if height H1 is twice that of height H2, standard cell 101 is referred to as a double height cell and standard cell 401 is referred to as a single height cell.

First rail layout pattern 118 a of FIG. 4 and second rail layout pattern 118 b of FIG. 4 are outbound power rail layout patterns. A center 120 b of first rail layout pattern 118 a of FIG. 4 is offset or shifted from a center 120 a of first active region layout pattern 404 a by a distance D4. In other words, the center 120 a of first active region layout pattern 404 a is not aligned with the center 120 b of first rail layout pattern 118 a. First rail layout pattern 118 a does not overlap first active region layout pattern 404 a. In some embodiments, first rail layout pattern 118 a overlaps a portion of first active region layout pattern 404 a. First rail layout pattern 118 a overlaps the side 130 a of standard cell 401. In some embodiments, the center 120 b of first rail layout pattern 118 a is aligned with the side 130 a of standard cell 401. In some embodiments, first rail layout pattern 118 a overlaps an edge of standard cell 401. In some embodiments, first rail layout pattern 118 a overlaps a portion of STI layout pattern 404 b.

A center 122 b of second rail layout pattern 118 b of FIG. 4 is offset or shifted from a center 122 a of second active region layout pattern 406 a by a distance D4′. In other words, the center 122 a of second active region layout pattern 406 a is not aligned with the center 122 b of second rail layout pattern 118 b. Second rail layout pattern 118 b does not overlap second active region layout pattern 406 a. In some embodiments, second rail layout pattern 118 b overlaps a portion of second active region layout pattern 406 a. Second rail layout pattern 118 b overlaps the side 130 b of standard cell 401. In some embodiments, the center 122 b of second rail layout pattern 118 b is aligned with the side 130 b of standard cell 401. In some embodiments, second rail layout pattern 118 b overlaps another edge of standard cell 401. In some embodiments, second rail layout pattern 118 b overlaps a portion of STI layout pattern 406 b.

First active region layout pattern 404 a is usable to manufacture a corresponding first active region 504 a (shown in FIGS. 5A-5B) of IC structure 500. First active region layout pattern 404 a has a width W1 c in the second direction Y. Width W1 c of first active region layout pattern 404 a is different from width W1 a of first active region layout pattern 104 a of FIG. 1 . In some embodiments, the width W1 c of first active region layout pattern 404 a ranges from 10% to 20% of the width W1 a of first active region layout pattern 104 a.

STI layout pattern 404 b is usable to manufacture a corresponding STI structure 504 b (shown in FIGS. 5A-5B) of IC structure 500. STI layout pattern 404 b has a width W2 c in the second direction Y.

Second active region layout pattern 406 a is usable to manufacture a corresponding second active region 506 a (shown in FIGS. 5A-5B) of IC structure 500. Second active region layout pattern 406 a has a width W1 d in the second direction Y. Width W1 d of second active region layout pattern 406 a is different from width W1 b of second active region layout pattern 106 a of FIG. 1 . In some embodiments, the width W1 d of second active region layout pattern 406 a ranges from 10% to 20% of the width W1 b of second active region layout pattern 106 a.

STI layout pattern 406 b is usable to manufacture a corresponding STI structure 506 b (shown in FIGS. 5A-5B) of IC structure 500. STI layout pattern 406 b has a width W2 c′ in the second direction Y.

STI layout pattern 102 a in FIG. 4 has a width W1′ in the second direction Y. Width W1′ of STI layout pattern 102 a in FIG. 4 is the sum of width W1, width W2 d and width W2 d′.

First set of fin layout patterns 410 includes fin layout patterns 410 a and 410 b. Other configurations or quantities of fins in the first set of fin layout patterns 410 are within the scope of the present disclosure. The first set of fin layout patterns 410 is usable to manufacture a corresponding first set of fins 510 (shown in FIGS. 5A-5B) of IC structure 500.

Second set of fin layout patterns 412 includes fin layout patterns 412 a and 412 b. Other configurations or quantities of fins in the second set of fin layout patterns 412 are within the scope of the present disclosure. The second set of fin layout patterns 412 is usable to manufacture a corresponding second set of fins 512 (shown in FIGS. 5A-5B) of IC structure 500.

In some embodiments, a width of widths W1, W1 c, W1 d, W2 c, W2 c′, W2 d, W2 d′, W4 a (shown in FIG. 3A) or W4 b (shown in FIG. 3A) or a distance of distances D4 or D4′ is the same as a different width of widths W1, W1 c, W1 d, W2 c, W2 c′, W2 d, W2 d′, W4 a (shown in FIG. 3A) or a different distance of distances D4 or D4′. In some embodiments, a width of widths W1, W1 c, W1 d, W2 c, W2 c′, W2 d, W2 d′, W4 a (shown in FIG. 3A) or W4 b (shown in FIG. 3A) or a distance of distances D4 or D4′ differs from a different width of widths W1, W1 c, W1 d, W2 c, W2 c′, W2 d, W2 d′, W4 a (shown in FIG. 3A) or a different distance of distances D4 or D4′.

FIGS. 5A and 5B are diagrams of an IC structure 500, in accordance with some embodiments. FIG. 5A is a cross-sectional view of IC structure 500 corresponding to layout design 400 as intersected by plane D-D′, and FIG. 5B is a cross-sectional view of IC structure 500 corresponding to layout design 400 as intersected by plane E-E′, in accordance with some embodiments. IC structure 500 is manufactured by layout design 400. Components that are the same or similar to those in FIGS. 2A-2C are given the same reference numbers, and detailed description thereof is thus omitted.

Structural relationships and configurations of IC structure 500 are similar to the structural relationships and configurations of layout design 400 of FIG. 4 , and will not be described in FIGS. 5A-5B for brevity.

IC structure 500 includes a first active region 504 a, a second active region 506 a, an intermediary region 207, STI 208, STI 504 b, STI 506 b, a first set of fins 510, a second set of fins 512, a first gate structure 214, a first dummy gate structure 216 a, a second dummy gate structure 216 b, a first rail 218 a, a second rail 218 b and STI 240. In some embodiments, IC structure is an IC of a standard cell 501.

First active region 504 a is similar to first active region 204 a, second active region 506 a is similar to second active region 206 a, STI 504 b and 506 b are similar to corresponding STI 204 b and 206 b, first set of fins 510 is similar to first set of fins 210, second set of fins 512 is similar to second set of fins 212, and similar detailed description of these structures is therefore omitted.

First rail 218 a of FIG. 5 and second rail 218 b of FIG. 5 are outbound power rails. A center of first rail 218 a of FIG. 5 is offset or shifted from a center 520 a of first active region 504 a by a distance D5. In other words, the center 520 a of first active region 504 a is not aligned with the center of first rail 218 a. First rail 218 a does not overlap first active region 504 a. In some embodiments, first rail 218 a overlaps a portion of first active region 504 a. First rail 218 a overlaps a side 530 a of standard cell 501. In some embodiments, the center of first rail 218 a is aligned with the side 530 a of standard cell 501. In some embodiments, first rail 218 a overlaps an edge of standard cell 501. In some embodiments, first rail 218 a overlaps a portion of STI 504 b.

A center of second rail 218 b of FIG. 5 is offset or shifted from a center 522 a of second active region 506 a by a distance D5′. In other words, the center 522 a of second active region 506 a is not aligned with the center of second rail 218 b. Second rail 218 b does not overlap second active region 506 a. In some embodiments, second rail 218 b overlaps a portion of second active region 506 a. Second rail 218 b overlaps a side 530 b of standard cell 501. In some embodiments, the center of second rail 218 b is aligned with the side 530 b of standard cell 501. In some embodiments, second rail 218 b overlaps another edge of standard cell 501. In some embodiments, second rail 218 b overlaps a portion of STI 506 b.

FIG. 6A is a diagram of a layout design 600A of a portion of an IC structure, in accordance with some embodiments. For ease of illustration, FIG. 6A includes additional elements not shown.

Layout design 600A includes an array 601 of standard cells having 1 row (e.g., Row 0) and 4 columns (e.g., Cols. 0, 1, 2 and 3). The 1 row of cells is arranged in the first direction X and the 4 columns of cells are arranged in the second direction Y. Row 0 is further divided to include 3 sub-rows (e.g., sub-rows A, B and C). The 3 sub-rows of cells are arranged in the first direction X. One row, three sub-rows and four columns of cells are used for illustration. A different number of rows, sub-rows or columns is within the contemplated scope of the present disclosure.

Each of the cells in array 601 corresponds to a standard cell of layout designs 100, 300A, 300B, 300C or 400.

Columns 0 and 2 of array 601 include corresponding cells 602 a and 604 a. Column 1 of array 601 includes cells 603 a, 603 b and 603 c. Column 3 of array 601 includes cells 605 a, 605 b and 605 c.

Row 0 of array 601 includes cells 602 a, 603 a, 603 b, 603 c, 604 a, 605 a, 605 b or 605 c. Cells 603 a, 603 b or 603 c are in the same corresponding sub-row A, B or C as corresponding cells 605 a, 605 b and 605 c. For example, sub-row A includes cells 603 a and 605 a, sub-row B includes cells 603 b and 605 b and sub-row C includes cells 603 c and 605 c.

A cell of cells 602 a, 603 a, 603 b, 603 c, 604 a, 605 a, 605 b or 605 c is standard cell 101, 301A, 301B, 301C or 400. In some embodiments, cells 602 a or 604 a is standard cells 101, 301A, 301B or 301C. In some embodiments, cells 603 a, 603 b, 603 c, 605 a, 605 b or 605 c is standard cell 401.

Cells 602 a and 604 a have a height H1 in the second direction Y, and cells 603 a, 603 b, 603 c, 605 a, 605 b and 605 c have a height H2 in the second direction Y. Height H1 of cells 602 a or 604 a differs from height H1 of cells 603 a, 603 b, 603 c, 605 a, 605 b or 605 c. In some embodiments, height H1 is twice that of height H2. In other words, in some embodiments, height H2 is half of height H1.

An edge of cells in adjacent columns in array 601 are separated from each other in the second direction Y by a distance D6. For example, an edge of cell 602 a or 604 a is offset or shifted in the second direction Y from an edge of cell 603 a or 605 a by a distance D6. Similarly, another edge of cell 602 a or 604 a is offset or shifted in the second direction Y from an edge of cell 603 c or 605 c by distance D6. In some embodiments, distance D6 is 50% of height H2. In some embodiments, distance D6 is 20% of height H1.

In some embodiments, one member of distance D6 or heights H1 or H2 is the same as a different member of distance D6 or heights H1 or H2. In some embodiments, one member of distance D6 or heights H1 or H2 differs from a different member of distance D6 or heights H1 or H2. In some embodiments, array 601 is an arrangement of cells of height H1 alternating with cells of height H2 in the first direction X.

Cells 602 a, 603 a, 603 b, 603 c, 604 a, 605 a, 605 b and 605 c have a corresponding center 602 a′, 603 a′, 603 b′, 603 c′, 604 a′, 605 a′, 605 b′ and 605 c′.

A center between cells in adjacent columns in array 601 are separated from each other in the first direction X by a pitch P3. For example, a center 602 a′ of cell 602 a is separated from a center 603 b′ of cell 603 b by a pitch P3. Similarly, the center 603 b′ of cell 603 b is separated from a center 604 a′ of cell 604 a by pitch P3, and the center 604 a′ of cell 604 a is separated from a center 605 b′ of cell 605 b by pitch P3.

Different configurations of arrays, layout designs or cells is within the contemplated scope of the present disclosure.

FIG. 6B is a diagram of a layout design 600B of a portion of an IC structure, in accordance with some embodiments.

Layout design 600B is a variation of layout design 600A. In comparison with layout design 600A, layout design 600B further includes a variation of layout design 100 implemented in each of cells 602 a and 604 a, and layout design 400 implemented in each of cells 603 a, 603 b and 603 c. In some embodiments, layout design 600B integrates the layout designs of standard cells 101, 301A, 301B, and 301C with standard cell 401.

For ease of illustration layout design 600A does not include cells 605 a, 605 b and 605 c of column 3 of array 601, first set of fin layout patterns 110 and second set of fin layout patterns 112. Different configurations of layout designs or cells is within the contemplated scope of the present disclosure.

Each of the cells in array 601 corresponds to a standard cell of layout designs 100, 300A, 300B, 300C or 400. For example, cell 602 a, 603 a, 603 b, 603 c, 604 a, 605 a, 605 b or 605 c is standard cell 101, 301A, 301B, 301C or 400. In some embodiments, cells 602 a or 604 a is standard cells 101, 301A, 301B or 301C. In some embodiments, cells 603 a, 603 b, 603 c, 605 a, 605 b or 605 c is standard cell 401.

Cell 602 a or 604 a includes layout design 100 (e.g., standard cell 101). Cell 603 a, 603 b or 603 c includes layout design 400 (e.g., standard cell 401). In some embodiments, one or more of layout designs 100, 300A-300C, 400, 700A-700D (shown in FIGS. 7A-7D) is implemented in one or more of cells 602 a, 603 a, 603 b, 603 c, 604 a, 605 a, 605 b or 605 c.

In comparison with layout design 100 of FIG. 1 , dummy gate layout patterns 616 a, 616 b and 616 c of cell 602 a replace the first dummy gate layout pattern 116 a of FIG. 1 , and dummy gate layout patterns 620 a, 620 b and 620 c of cell 602 a replace the second dummy gate layout pattern 116 b of FIG. 1 . Alternatively, dummy gate layout patterns 620 a, 620 b and 620 c are part of corresponding cells 603 a, 603 b and 603 c, and replace the corresponding first dummy gate layout pattern 116 a of FIG. 4 for each corresponding cell 603 a, 603 b and 603 c.

Similarly, dummy gate layout patterns 622 a, 622 b and 622 c of cell 604 a replace the first dummy gate layout pattern 116 a of FIG. 1 , and dummy gate layout patterns 624 a, 624 b and 624 c of cell 604 a replace the second dummy gate layout pattern 116 b of FIG. 1 . Alternatively, dummy gate layout patterns 622 a, 622 b and 622 c are part of corresponding cells 603 a, 603 b and 603 c, and replace the corresponding second dummy gate layout pattern 116 b of FIG. 4 for each corresponding cell 603 a, 603 b and 603 c.

Dummy gate layout patterns 616 a, 616 b and 616 c are similar to corresponding dummy gate layout patterns 140 a, 140 b and 140 c, dummy gate layout patterns 622 a, 622 b and 622 c are similar to corresponding dummy gate layout patterns 140 a, 140 b and 140 c, and detailed description is therefore omitted.

Dummy gate layout patterns 620 a, 620 b and 620 c are similar to corresponding dummy gate layout patterns 142 a, 142 b and 142 c, dummy gate layout patterns 624 a, 624 b and 624 c are similar to corresponding dummy gate layout patterns 142 a, 142 b and 142 c, and detailed description is therefore omitted.

In comparison with layout design 100 of FIG. 1 , gate layout pattern 617 of cell 604 a replaces the first gate layout pattern 114 of FIG. 1 .

In comparison with layout design 400 of FIG. 4 , gate layout pattern 614 a of cell 603 a replaces the first gate layout pattern 114, gate layout pattern 614 b of cell 603 b replaces the first gate layout pattern 114, gate layout pattern 614 c of cell 603 c replaces the first gate layout pattern 114, rail layout pattern 618 b of cell 603 a replaces the second rail layout pattern 118 b of FIG. 4 , and rail layout pattern 618 a of cell 603 c replaces the first rail layout pattern 118 a of FIG. 4 .

Gate layout patterns 614 a, 614 b and 614 c are similar to first gate layout pattern 114 a, rail layout pattern 618 a is similar to first rail layout pattern 118 a, rail layout pattern 618 b is similar to second rail layout pattern 118 b, and detailed description is therefore omitted.

Gate layout pattern 614 a is discontinuous from gate layout pattern 614 b.

Gate layout pattern 614 b is discontinuous from gate layout pattern 614 c.

In some embodiments, a center 120 a of the first active region layout pattern 104 a of cell 602 a or 604 a is aligned with a side of cell 603 a or 603 b in the first direction X. In some embodiments, a center 122 a of the second active region layout pattern 106 a of cell 602 a or 604 a is aligned with a side of cell 603 b or 603 c in the first direction X.

In some embodiments, the first rail layout pattern 118 a overlaps a side of cell 603 a or 603 b, and center 120 a of the first active region layout pattern 104 a of cell 602 a or 604 a. In some embodiments, the second rail layout pattern 118 b overlaps a side of cell 603 b or 603 c, and center 122 a of the second active region layout pattern 106 a of cell 602 a or 604 a.

In some embodiments, the rail layout pattern 618 a overlaps a side of cell 603 c. In some embodiments, the rail layout pattern 618 b overlaps a side of cell 603 a. In some embodiments, the first active region layout pattern 104 a and the second active region layout pattern 106 a have a larger area than other approaches. As the area of the first active region layout pattern 106 a and second active area layout pattern 106 a is increased, the corresponding active region (first active region 204 a and second active region 206 a) of IC structure 200 manufactured by layout design 100 or 600B is increased, resulting in a layout design 100 or 600B and a corresponding IC structure (e.g., IC structure 200) with increased speed performance and power performance compared to other approaches.

FIG. 7A is a diagram of a layout design 700A of a portion of an IC structure, in accordance with some embodiments.

For ease of illustration, gate layout patterns (e.g., first gate layout pattern 114, gate layout patterns 614 a-614 c, and 617) of FIG. 6B, rail layout patterns (e.g., first rail layout pattern 118 a, second rail layout pattern 118 b, rail layout patterns 618 a-618 b) of FIG. 6B, and dummy gate layout patterns 616 a-616 c, 620 a-620 c, 622 a-622 c, 624 a-624 c of FIG. 6B, are not shown in FIGS. 7A-7D.

Layout design 700A is a variation of layout design 600B. In comparison with layout design 600B, an active region layout pattern 702, an active region layout pattern 704 and an STI layout pattern 706 of layout design 700A replace the first active region layout pattern 104 a of cell 604 a of FIG. 6B.

Active region layout pattern 702 and 704 are similar to first active region layout pattern 104 a, STI layout pattern 706 is similar to STI layout pattern 104 b, and similar detailed description of the layout patterns is therefore omitted.

Active region layout pattern 702 extends in the first direction X, has a width W5 a in the second direction Y.

Active region layout pattern 704 extends in the first direction X, has a width W5 b in the second direction Y.

STI layout pattern 706 extends in the first direction X, and has a width W5 c in the second direction Y. STI layout pattern 706 is between active region layout pattern 704 and active region layout pattern 702.

In some embodiments, first active region layout pattern 104 a of cell 602 a, second active region layout pattern 406 a of cell 603 a, first active region layout pattern 404 a of cell 603 b, active region layout pattern 702, and active region layout pattern 704 form an active region layout pattern having an C-shape. Different configurations of layout designs or cells is within the contemplated scope of the present disclosure.

FIG. 7B is a diagram of a layout design 700B of a portion of an IC structure, in accordance with some embodiments.

Layout design 700B is a variation of layout design 600B. In comparison with layout design 600B, active region layout pattern 704 and an STI layout pattern 710 of layout design 700B replace the first active region layout pattern 104 a of cell 604 a of FIG. 6B.

Active region layout pattern 704 is similar to first active region layout pattern 104 a, STI layout pattern 710 is similar to STI layout pattern 104 b, and similar detailed description of the layout patterns is therefore omitted.

STI layout pattern 710 extends in the first direction X, and has a width W5 a′ in the second direction Y. STI layout pattern 710 is between active region layout pattern 704 and STI layout pattern 104 b of cell 604 a.

In some embodiments, first active region layout pattern 104 a of cell 602 a, second active region layout pattern 406 a of cell 603 a, first active region layout pattern 404 a of cell 603 b and active region layout pattern 704 form an active region layout pattern having an G-shape. Different configurations of layout designs or cells is within the contemplated scope of the present disclosure.

FIG. 7C is a diagram of a layout design 700C of a portion of an IC structure, in accordance with some embodiments.

Layout design 700C is a variation of layout design 600B. In comparison with layout design 600B, an STI layout pattern 720 of layout design 700C replaces the first active region layout pattern 404 a of cell 603 b of FIG. 6B.

STI layout pattern 720 is similar to STI layout pattern 406 b, and similar detailed description of the layout patterns is therefore omitted.

STI layout pattern 720 extends in the first direction X, and has a width W1 c in the second direction Y. STI layout pattern 720 is between STI layout pattern 102 a of cell 603 b and STI layout pattern 406 b of cell 603 b. The width W1 c of STI layout pattern 720 and the width W2 d of STI layout pattern 406 b together have a width W6 a in the second direction Y.

In some embodiments, first active region layout pattern 104 a of cell 602 a, second active region layout pattern 406 a of cell 603 a, and first active region layout pattern 104 a of cell 604 a form an active region layout pattern having an N-shape. Different configurations of layout designs or cells is within the contemplated scope of the present disclosure.

FIG. 7D is a diagram of a layout design 700D of a portion of an IC structure, in accordance with some embodiments.

Layout design 700D is a variation of layout design 600B. In comparison with layout design 600B, an STI layout pattern 722 of layout design 700D replaces the first active region layout pattern 104 a of cell 604 a of FIG. 6B.

STI layout pattern 722 is similar to STI layout pattern 104 b, and similar detailed description of the layout patterns is therefore omitted.

STI layout pattern 722 extends in the first direction X, and has a width W6 b in the second direction Y. STI layout pattern 722 is between STI layout pattern 102 a of cell 604 a and STI layout pattern 104 b of cell 604 a.

In some embodiments, first active region layout pattern 104 a of cell 602 a, second active region layout pattern 406 a of cell 603 a and first active region layout pattern 404 a of cell 603 b form an active region layout pattern having another C-shape. Different configurations of layout designs or cells is within the contemplated scope of the present disclosure.

In some embodiments, a width of widths W1, W1 a, W1 a′, W1 b, W1 b′, W1 c, W1 d, W2 a, W2 a′, W2 b, W2 b′, W2 c, W2 c′, W2 d, W2 d′, W4 a, W4 b, W5 a, W5 a′, W5 b, W5 c, W6 a, or W6 b is the same as a different width of widths W1, W1 a, W1 a′, W1 b, W1 b′, W1 c, W1 d, W2 a, W2 a′, W2 b, W2 b′, W2 c, W2 c′, W2 d, W2 d′, W4 a, W4 b, W5 a, W5 a′, W5 b, W5 c, W6 a, or W6 b. In some embodiments, a width of widths W1, W1 a, W1 a′, W1 b, W1 b′, W1 c, W1 d, W2 a, W2 a′, W2 b, W2 b′, W2 c, W2 c′, W2 d, W2 d′, W4 a, W4 b, W5 a, W5 a′, W5 b, W5 c, W6 a, or W6 b differs from a different width of widths W1, W1 a, W1 a′, W1 b, W1 b′, W1 c, W1 d, W2 a, W2 a′, W2 b, W2 b′, W2 c, W2 c′, W2 d, W2 d′, W4 a, W4 b, W5 a, W5 a′, W5 b, W5 c, W6 a, or W6 b.

FIG. 8 is a flowchart of a method 800 of forming or manufacturing an IC in accordance with some embodiments. It is understood that additional operations may be performed before, during, and/or after the method 800 depicted in FIG. 8 , and that some other processes may only be briefly described herein. In some embodiments, the method 800 is usable to form integrated circuits, such as IC structure 200 or 500 (FIG. 2A-2C or 5A-5B). In some embodiments, the method 800 is usable to form integrated circuits having similar structural relationships as one or more of layout designs 100, 300A-300C, 400, 600A-600B, 700A-700D (FIG. 1, 3A-3C, 4, 6A-6B or 7A-7D).

In operation 802 of method 800, a first cell layout pattern is generated. The first cell layout pattern corresponds to fabricating a standard cell 201 of IC structure 200. In some embodiments, the first cell layout pattern of method 800 includes one or more of layout designs 100, 300A-300C, 600A-600B and 700A-700C. In some embodiments, the first cell layout pattern of method 800 includes one or more of cells 602 a or 604 a shown in FIGS. 6A-6B and 7A-7D.

In operation 804, the first cell layout pattern is placed on a layout level. In some embodiments, the first cell layout pattern of method 800 is placed similar to the orientation of cells 602 a or 604 a shown in layout design 600A-600B and 700A-700C. In some embodiments, the first cell layout pattern of method 800 is placed in cells 602 a or 604 a as shown in FIGS. 6A-6B and 7A-7D. Other configurations of cells or levels are within the scope of the present disclosure.

In operation 806, a second cell layout pattern is generated. The second cell layout pattern corresponds to fabricating a standard cell 501 of IC structure 500. In some embodiments, the second cell layout pattern of method 800 includes one or more of layout designs 400, 600A-600B and 700A-700C. In some embodiments, the second cell layout pattern of method 800 includes one or more of cells 603 a, 603 b, 603 c, 605 a, 605 b or 605 c shown in FIGS. 6A-6B and 7A-7D.

In operation 808, a second cell layout pattern is placed on the layout level. In some embodiments, the second cell layout pattern is placed adjacent to the first cell layout pattern. In some embodiments, the second cell layout pattern of method 800 is placed similar to the orientation of cells 603 a, 603 b, 603 c, 605 a, 605 b or 605 c shown in layout designs 600A-600B and 700A-700C. In some embodiments, the second cell layout pattern of method 800 is placed in cells 603 a, 603 b, 603 c, 605 a, 605 b or 605 c shown in FIGS. 6A-6B and 7A-7D. Other configurations of cells or levels are within the scope of the present disclosure.

In operation 810, IC structure 200 or 500 is manufactured based on at least the first cell layout pattern or the second cell layout pattern. In some embodiments, operation 808 includes one or more operations to manufacture a set of masks based on one or more layout patterns (e.g., the first cell layout pattern or the second cell layout pattern) of method 800 or method 900A-900B. In these embodiments, method 800 further includes one or more operations to manufacture IC structure 200 or 500 using the set of masks.

One or more of operations 802, 804, 806 or 808 is performed by a processing device (e.g., system 1000 of FIG. 10 ) configured to execute instructions for manufacturing an IC, such as IC structure 200 or 500. In some embodiments, one or more of operations 802, 804, 806 or 808 is performed using a same processing device as that used in a different one or more of operations 802, 804, 806 or 808. In some embodiments, a different processing device is used to perform one or more of operations 802, 804, 806 or 808 from that used to perform a different one or more of operations 802, 804, 806 or 808. In some embodiments, one or more of operations 802, 804, 806 or 808 is optional.

FIG. 9A is a flowchart of a method 900A of generating a cell layout pattern of an IC in accordance with some embodiments. It is understood that additional operations may be performed before, during, and/or after the method 900A depicted in FIG. 9A, and that some other processes may only be briefly described herein. In some embodiments, the method 900A is usable to generate layout designs 100, 300A-300C, 400, 600A-600B or 700A-700D (FIG. 1, 3A-3C, 4, 6A-6B or 7A-7D) of integrated circuits, such as IC structure 200 or 500 (FIG. 2A-2C or 5A-5B). In some embodiments, method 900A is usable to generate layout designs of integrated circuits having similar structural relationships as one or more of layout designs 100, 300A-300C, 400, 600A-600B or 700A-700D (FIG. 1, 3A-3C, 4, 6A-6B or 7A-7D).

Method 900A is an embodiment of operation 802 or operation 806 of FIG. 8 with similar elements. In some embodiments, operation 802 generates a first cell layout pattern similar to layout pattern 100 based on method 900A, and operation 806 generates a second cell layout pattern similar to layout design 400 based on method 900A. In some embodiments, method 900A is repeated to generate additional layout patterns similar to one or more of layout design 600A-600B or 700A-700D.

In operation 902 of method 900A, a first set of active region layout patterns is generated. In some embodiments, the first set of active region layout patterns of method 900A includes at least first active region layout pattern 104 a, 304 a or 404 a or active region layout pattern 702 or 704, and detailed description of these layout patterns is therefore omitted.

In operation 904, a second set of active region layout patterns is generated. In some embodiments, the second set of active region layout patterns of method 900A includes at least second active region layout pattern 106 a, 306 a or 406 a, or active region layout pattern 702 or 704, and detailed description of these layout patterns is therefore omitted.

In operation 906, a set of STI layout patterns is generated. In some embodiments, the STI layout patterns of method 900A includes at least STI layout patterns 102 a, 104 b, 106 b, 304 b, 306 b, 404 b, 406 b, 706, 710, 720 or 722, and detailed description of these layout patterns is therefore omitted.

In operation 908, a set of fin layout patterns is generated. In some embodiments, the set of fin layout patterns of method 900A includes at least the first set of fin layout patterns 110, second set of fin layout patterns 112, the first set of fin layout patterns 410 or second set of fin layout patterns 412, and detailed description of these layout patterns is therefore omitted.

In operation 910, a set of gate layout patterns is generated. In some embodiments, the set of gate layout patterns of method 900A includes at least the first gate layout pattern 114, second gate layout pattern 314 a, third gate layout pattern 314 b, gate layout pattern 614 a, gate layout pattern 614 b, gate layout pattern 614 c or gate layout pattern 617, and detailed description of these layout patterns is therefore omitted.

In operation 912, a set of dummy gate layout patterns is generated. In some embodiments, the set of dummy gate layout patterns of method 900A includes at least the first dummy gate layout pattern 116 a, second dummy gate layout pattern 116 b, dummy gate layout pattern 140 a, dummy gate layout pattern 140 b, dummy gate layout pattern 140 c, dummy gate layout pattern 142 a, dummy gate layout pattern 142 b, dummy gate layout pattern 142 c, dummy gate layout pattern 616 a, dummy gate layout pattern 616 b, dummy gate layout pattern 616 c, dummy gate layout pattern 620 a, dummy gate layout pattern 620 b, dummy gate layout pattern 620 c, dummy gate layout pattern 622 a, dummy gate layout pattern 622 b, dummy gate layout pattern 622 c, dummy gate layout pattern 624 a, dummy gate layout pattern 624 b or dummy gate layout pattern 624 c, and detailed description of these layout patterns is therefore omitted.

In operation 914, a set of via layout patterns is generated. In some embodiments, the set of via layout patterns of method 900A includes at least via layout pattern 132 a, via layout pattern 132 b, or via layout pattern 132 c, and detailed description of these layout patterns is therefore omitted.

In operation 916, a set of rail layout patterns is generated. In some embodiments, the set of rail layout patterns of method 900A includes at least the first rail layout pattern 118 a, second rail layout pattern 118 b, rail layout pattern 618 a or rail layout pattern 618 b, and detailed description of these layout patterns is therefore omitted.

FIG. 9B is a flowchart of a method 900B of placing a cell layout pattern of an IC in accordance with some embodiments. It is understood that additional operations may be performed before, during, and/or after the method 900B depicted in FIG. 9B, and that some other processes may only be briefly described herein. In some embodiments, the method 900B is usable to place layout designs 100, 300A-300C, 400, 600A-600B or 700A-700D (FIG. 1, 3A-3C, 4, 6A-6B or 7A-7D) of integrated circuits, such as IC structure 200 or 500 (FIG. 2A-2C or 5A-5B). In some embodiments, method 900B is usable to place layout designs of integrated circuits having similar structural relationships as one or more of layout designs 100, 300A-300C, 400, 600A-600B or 700A-700D (FIG. 1, 3A-3C, 4, 6A-6B or 7A-7D).

Method 900B is an embodiment of operation 804 or operation 808 of FIG. 8 with similar elements. In some embodiments, operation 804 places a first cell layout pattern similar to layout pattern 100 based on method 900B, and operation 808 places a second cell layout pattern similar to layout design 400 based on method 900B. In some embodiments, method 900B is repeated to place additional layout patterns similar to one or more of layout design 600A-600B or 700A-700D.

In operation 922, the first set of active region layout patterns is placed on a first layout level. In some embodiments, the first set of active region layout patterns of method 900B includes at least first active region layout patterns 104 a, 304 a or 404 a, or active region layout pattern 702 or 704, and detailed description of these layout patterns is therefore omitted.

In operation 924, the second set of active region layout patterns is placed on the first layout level. In some embodiments, the second set of active region layout patterns of method 900B includes at least second active region layout patterns 106 a, 306 a or 406 a, or active region layout pattern 702 or 704, and detailed description of these layout patterns is therefore omitted.

In operation 926, the set of STI layout patterns is placed on a second layout level. In some embodiments, at least one member of the set of STI layout patterns is placed between the first active region layout pattern and the second active region layout pattern. In some embodiments, the STI layout patterns of method 900B includes at least STI layout patterns 102 a, 104 b, 106 b, 304 b, 306 b, 404 b, 406 b, 706, 710, 720 or 722, and detailed description of these layout patterns is therefore omitted.

In operation 928, the set of fin layout patterns is placed over the first set of active region layout patterns and the second set of active region layout pattern. In some embodiments, the set of fin layout patterns of method 900B includes at least the first set of fin layout patterns 110, second set of fin layout patterns 112, the first set of fin layout patterns 410 or second set of fin layout patterns 412, and detailed description of these layout patterns is therefore omitted.

In operation 930, the set of gate layout patterns is placed on a third layout level. In some embodiments, the set of gate layout patterns of method 900B includes at least the first gate layout pattern 114, second gate layout pattern 314 a, third gate layout pattern 314 b, gate layout pattern 614 a, gate layout pattern 614 b, gate layout pattern 614 c or gate layout pattern 617, and detailed description of these layout patterns is therefore omitted.

In operation 932, the set of dummy gate layout patterns is placed on the third layout level. In some embodiments, the set of dummy gate layout patterns of method 900B includes at least the first dummy gate layout pattern 116 a, second dummy gate layout pattern 116 b, dummy gate layout pattern 140 a, dummy gate layout pattern 140 b, dummy gate layout pattern 140 c, dummy gate layout pattern 142 a, dummy gate layout pattern 142 b, dummy gate layout pattern 142 c, dummy gate layout pattern 616 a, dummy gate layout pattern 616 b, dummy gate layout pattern 616 c, dummy gate layout pattern 620 a, dummy gate layout pattern 620 b, dummy gate layout pattern 620 c, dummy gate layout pattern 622 a, dummy gate layout pattern 622 b, dummy gate layout pattern 622 c, dummy gate layout pattern 624 a, dummy gate layout pattern 624 b or dummy gate layout pattern 624 c, and detailed description of these layout patterns is therefore omitted.

In operation 934, the set of via layout patterns is placed over the set of gate layout patterns. In some embodiments, the set of via layout patterns of method 900A includes at least via layout pattern 132 a, via layout pattern 132 b, or via layout pattern 132 c, and detailed description of these layout patterns is therefore omitted.

In operation 936, the set of rail layout patterns is placed on a fourth layout level. In some embodiments, the set of rail layout patterns of method 900A includes at least the first rail layout pattern 118 a, second rail layout pattern 118 b, rail layout pattern 618 a or rail layout pattern 618 b, and detailed description of these layout patterns is therefore omitted.

One or more of operations 902, 904, 906, 908, 910, 912, 914, 916, 922, 924, 926, 928, 930, 932, 934 or 936 is performed by a processing device (e.g., system 1000 of FIG. 10 ) configured to execute instructions for manufacturing an IC, such as IC structure 200 or 500. In some embodiments, one or more of operations 902, 904, 906, 908, 910, 912, 914, 916, 922, 924, 926, 928, 930, 932, 934 or 936 is performed using a same processing device as that used in a different one or more of operations 902, 904, 906, 908, 910, 912, 914, 916, 922, 924, 926, 928, 930, 932, 934 or 936. In some embodiments, a different processing device is used to perform one or more of operations 902, 904, 906, 908, 910, 912, 914, 916, 922, 924, 926, 928, 930, 932, 934 or 936 from that used to perform a different one or more of operations 902, 904, 906, 908, 910, 912, 914, 916, 922, 924, 926, 928, 930, 932, 934 or 936. In some embodiments, one or more of operations 902, 904, 906, 908, 910, 912, 914, 916, 922, 924, 926, 928, 930, 932, 934 or 936 is optional.

FIG. 10 is a schematic view of a system 1000 for designing an IC layout design in accordance with some embodiments. System 1000 includes a hardware processor 1002 (hereinafter “processor 1002”) and a non-transitory, computer readable storage medium 1004 (hereinafter “computer readable storage medium 1004”) encoded with, i.e., storing, the computer program code 1006, i.e., a set of executable instructions. Computer readable storage medium 1004 is also encoded with instructions 1007 for interfacing with manufacturing machines for producing the integrated circuit. The processor 1002 is electrically coupled to the computer readable storage medium 1004 via a bus 1008. The processor 1002 is also electrically coupled to an I/O interface 1010 by bus 1008. A network interface 1012 is also electrically connected to the processor 1002 via bus 1008. Network interface 1012 is connected to a network 1014, so that processor 1002 and computer readable storage medium 1004 are capable of connecting to external elements via network 1014. The processor 1002 is configured to execute the computer program code 1006 encoded in the computer readable storage medium 1004 in order to cause system 1000 to be usable for performing a portion or all of the operations as described in method 800, 900A or 900B.

In some embodiments, the processor 1002 is a central processing unit (CPU), a multi-processor, a distributed processing system, an application specific integrated circuit (ASIC), and/or a suitable processing unit.

In some embodiments, the computer readable storage medium 1004 is an electronic, magnetic, optical, electromagnetic, infrared, and/or a semiconductor system (or apparatus or device). For example, the computer readable storage medium 1004 includes a semiconductor or solid-state memory, a magnetic tape, a removable computer diskette, a random access memory (RAM), a read-only memory (ROM), a rigid magnetic disk, and/or an optical disk. In some embodiments using optical disks, the computer readable storage medium 1004 includes a compact disk-read only memory (CD-ROM), a compact disk-read/write (CD-R/W), and/or a digital video disc (DVD).

In some embodiments, the computer readable storage medium 1004 stores the computer program code 1006 configured to cause system 1000 to perform method 800, 900A or 900B. In some embodiments, the computer readable storage medium 1004 also stores information needed for performing method 800, 900A or 900B as well as information generated during performing method 800, 900A or 900B, such as layout design 1016, first set of active region layout patterns 1018, second set of active region layout patterns 1020, set of STI layout patterns 1022, set of fin layout patterns 1024, set of gate layout patterns 1026, set of dummy gate layout patterns 1028, set of via layout patterns 1030, set of rail layout patterns 1032 and user interface 1034, and/or a set of executable instructions to perform the operation of method 800, 900A or 900B.

In some embodiments, the computer readable storage medium 1004 stores instructions 1007 for interfacing with manufacturing machines. The instructions 1007 enable processor 1002 to generate manufacturing instructions readable by the manufacturing machines to effectively implement method 800, 900A or 900B during a manufacturing process.

System 1000 includes I/O interface 1010. I/O interface 1010 is coupled to external circuitry. In some embodiments, I/O interface 1010 includes a keyboard, keypad, mouse, trackball, trackpad, and/or cursor direction keys for communicating information and commands to processor 1002.

System 1000 also includes network interface 1012 coupled to the processor 1002. Network interface 1012 allows system 1000 to communicate with network 1014, to which one or more other computer systems are connected. Network interface 1012 includes wireless network interfaces such as BLUETOOTH, WIFI, WIMAX, GPRS, or WCDMA; or wired network interface such as ETHERNET, USB, or IEEE-1394. In some embodiments, method 800, 900A or 900B is implemented in two or more systems 1000, and information such as layout design, first set of active region layout patterns, second set of active region layout patterns, set of STI layout patterns, set of fin layout patterns, set of gate layout patterns, set of dummy gate layout patterns, set of via layout patterns, set of rail layout patterns and user interface are exchanged between different systems 1000 by network 1014.

System 1000 is configured to receive information related to a layout design through I/O interface 1010 or network interface 1012. The information is transferred to processor 1002 by bus 1008 to determine a layout design for producing IC structure 200 or 500. The layout design is then stored in computer readable medium 1004 as layout design 1016. System 1000 is configured to receive information related to a first set of active region layout patterns through I/O interface 1010 or network interface 1012. The information is stored in computer readable medium 1004 as first set of active region layout patterns 1018. System 1000 is configured to receive information related to a second set of active region layout patterns through I/O interface 1010 or network interface 1012. The information is stored in computer readable medium 1004 as second set of active region layout patterns 1020. System 1000 is configured to receive information related to a set of STI layout patterns through I/O interface 1010 or network interface 1012. The information is stored in computer readable medium 1004 as set of STI layout patterns 1022. System 1000 is configured to receive information related to a set of fin layout patterns through I/O interface 1010 or network interface 1012. The information is stored in computer medium 1004 as set of fin layout patterns 1024. System 1000 is configured to receive information related to a set of gate layout patterns through I/O interface 1010 or network interface 1012. The information is stored in computer readable medium 1004 as set of gate layout patterns 1026. System 1000 is configured to receive information related to a set of dummy gate layout patterns through I/O interface 1010 or network interface 1012. The information is stored in computer readable medium 1004 as set of dummy gate layout patterns 1028. System 1000 is configured to receive information related to a set of via layout patterns through I/O interface 1010 or network interface 1012. The information is stored in computer readable medium 1004 as set of via layout patterns 1030. System 1000 is configured to receive information related to a set of rail layout patterns through I/O interface 1010 or network interface 1012. The information is stored in computer readable medium 1004 as set of rail layout patterns 1032. System 1000 is configured to receive information related to a user interface through I/O interface 1010 or network interface 1012. The information is stored in computer readable medium 1004 as user interface 1034.

In some embodiments, portions of method 800, 900A or 900B is implemented as a standalone software application for execution by a processor. In some embodiments, portions of method 800, 900A or 900B is implemented as a software application that is a part of an additional software application. In some embodiments, portions of method 800, 900A or 900B is implemented as a plug-in to a software application. In some embodiments, portions of method 800, 900A or 900B is implemented as a software application that is a portion of an EDA tool. In some embodiments, portions of method 800, 900A or 900B is implemented as a software application that is used by an EDA tool. In some embodiments, the EDA tool is used to generate a layout of the integrated circuit device. In some embodiments, the layout is stored on a non-transitory computer readable medium. In some embodiments, the layout is generated using a tool such as VIRTUOSO® available from CADENCE DESIGN SYSTEMS, Inc., or another suitable layout generating tool. In some embodiments, the layout is generated based on a netlist which is created based on the schematic design. In some embodiments, method 800, 900A or 900B is implemented by a manufacturing device configured to manufacture an integrated circuit (e.g., IC structure 200 or 500) using a set of masks manufactured based on one or more layout designs (e.g., layout design 100, 300A, 300B, 300C, 400, 600A, 600B, 700A, 700B, 700C or 700D) generated by system 1000.

System 1000 of FIG. 10 generates layout designs (e.g., layout design 100, 300A, 300B, 300C, 400, 600A, 600B, 700A, 700B, 700C or 700D) of IC structure 200 or 500 that occupy less area and provide better routing resources than other approaches.

One aspect of this description relates to an integrated circuit structure. The integrated circuit structure includes a first cell, a first rail, and a second rail. In some embodiments, the first cell includes a first active region having a first dopant type, extending in a first direction and being located at a first level. In some embodiments, the first cell further includes a second active region having a second dopant type, extending in the first direction, being located at the first level, and being separated from the first active region in a second direction different from the first direction. In some embodiments, the first cell further includes a first gate structure extending in the second direction, overlapping at least the first active region or the second active region, and being located at a second level different from the first level. In some embodiments, the first cell further includes a second gate structure extending in the second direction, overlapping at least a first edge of the first active region or the second active region, and being located at the second level. In some embodiments, the first cell further includes a third gate structure extending in the second direction, overlapping at least a second edge of the first active region or the second active region, and being located at the second level. In some embodiments, the first rail extending in the first direction, overlapping a middle portion of the first active region, being configured to supply a first supply voltage, and being located at a third level different from the first level and the second level. In some embodiments, the second rail extending in the first direction, overlapping a middle portion of the second active region, being located at the third level, being separated from the first rail in the second direction, and being configured to supply a second supply voltage different from the first supply voltage.

Another aspect of this description relates to a method of forming an integrated circuit structure. In some embodiments, placing a first standard cell layout on a layout, and manufacturing the integrated circuit based on at least one of the above patterns of the integrated circuit. In some embodiments, the placing the first standard cell layout includes placing a first active region pattern on a first layout level, the first active region pattern corresponding to fabricating a first active region of the integrated circuit, the first active region pattern extending in a first direction. In some embodiments, the placing the first standard cell layout further includes placing a second active region pattern on the first layout level, the second active region pattern corresponding to fabricating a second active region of the integrated circuit, the second active region pattern extending in the first direction and being separated from the first active region pattern in a second direction different from the first direction. In some embodiments, the method further includes placing a first power rail pattern on a second layout level different from the first layout level, the first power rail pattern corresponding to fabricating a first power rail of the integrated circuit, the first power rail being configured to supply a first supply voltage, the first power rail pattern extending in the first direction and overlapping a middle portion of the first active region pattern. In some embodiments, the method further includes placing a second power rail pattern on the second layout level, the second power rail pattern corresponding to fabricating a second power rail of the integrated circuit, the second power rail being configured to supply a second supply voltage, the second power rail pattern extending in the first direction and overlapping a middle portion of the second active region pattern. In some embodiments, at least one of the above patterns is stored on a non-transitory computer-readable medium, and at least one of the above operations is performed by a hardware processor.

Still another aspect of this description relates to a method of forming an integrated circuit structure. The method including generating a first standard cell layout, generating a first power rail pattern corresponding to fabricating a first power rail of the integrated circuit, generating a second power rail pattern corresponding to fabricating a second power rail of the integrated circuit, and manufacturing the integrated circuit based on at least one of the above patterns of the integrated circuit. In some embodiments, at least one of the above patterns is stored on a non-transitory computer-readable medium, and at least one of the above operations is performed by a hardware processor. In some embodiments, the first standard cell layout includes a first side and a second side on an opposite side of the first standard cell layout from the first side. In some embodiments, the generating the first standard cell layout includes generating a first active region pattern corresponding to fabricating a first active region of the integrated circuit, the first active region pattern extending in a first direction, and being located on a first layout level. In some embodiments, the generating the first standard cell layout further includes generating a second active region pattern corresponding to fabricating a second active region of the integrated circuit the second active region pattern extending in the first direction and being located on the first layout level, and being separated from the first active region pattern in a second direction different from the first direction. In some embodiments, the generating the first standard cell layout further includes generating a shallow trench isolation (STI) pattern corresponding to fabricating a STI structure of the integrated circuit, the STI pattern being between the first active region pattern and the second active region pattern. In some embodiments, the generating the first standard cell layout further includes generating a first gate pattern corresponding to fabricating a first gate of the integrated circuit, the first gate pattern extending in the second direction, overlapping the first active region pattern and the second active region pattern, and being located on a second layout level different from the first layout level. In some embodiments, the first power rail pattern extending in the first direction, overlapping the first active region pattern, and being located on a third layout level different from the first layout level and the second layout level, the first power rail being configured to supply a first supply voltage. In some embodiments, the second power rail being configured to supply a second supply voltage different from the first supply voltage, the second power rail pattern extending in the first direction, being located on the third layout level, and being separated from the first power rail pattern in the second direction.

The foregoing outlines features of several embodiments so that those skilled in the art may better understand the aspects of the present disclosure. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions, and alterations herein without departing from the spirit and scope of the present disclosure. 

What is claimed is:
 1. An integrated circuit structure comprising: a first cell comprising: a first active region having a first dopant type, extending in a first direction and being located at a first level; a second active region having a second dopant type, extending in the first direction, being located at the first level, and being separated from the first active region in a second direction different from the first direction; a first gate structure extending in the second direction, overlapping at least the first active region or the second active region, and being located at a second level different from the first level; a second gate structure extending in the second direction, overlapping at least a first edge of the first active region or the second active region, and being located at the second level; and a third gate structure extending in the second direction, overlapping at least a second edge of the first active region or the second active region, and being located at the second level; a first rail extending in the first direction, overlapping a middle portion of the first active region, being configured to supply a first supply voltage, and being located at a third level different from the first level and the second level, and a second rail extending in the first direction, overlapping a middle portion of the second active region, being located at the third level, being separated from the first rail in the second direction, and being configured to supply a second supply voltage different from the first supply voltage.
 2. The integrated circuit structure of claim 1, wherein the first gate structure is between the second gate structure and the third gate structure.
 3. The integrated circuit structure of claim 1, wherein the first cell further comprises: a first set of fins being over the first active region and below the first gate structure and extending in the first direction, each fin of the first set of fins being separated from an adjacent fin of the first set of fins in the second direction by a first fin pitch.
 4. The integrated circuit structure of claim 3, wherein the first cell further comprises: a second set of fins being over the second active region and below the first gate structure and extending in the first direction, each fin of the second set of fins being separated from an adjacent fin of the second set of fins in the second direction by a second fin pitch.
 5. The integrated circuit structure of claim 1, wherein at least the second gate structure or the third gate structure is a dummy gate structure.
 6. The integrated circuit structure of claim 1, wherein the first active region has a first width in the second direction, and the second active region has a second width in the second direction different from the first width.
 7. The integrated circuit structure of claim 1, further comprising: a second cell adjacent to the first cell, the second cell comprising: a third active region having the first dopant type, extending in the first direction and being located at the first level; a fourth active region having the first dopant type, extending in the first direction, being located at the first level, and being separated from the third active region in the second direction; a fourth gate structure extending in the second direction, being separated from the first gate structure in the second direction, overlapping the third active region and the fourth active region and being located at the second level; a first side extending in the first direction, and a second side extending in the first direction and being an opposite side of the second cell from the first side, wherein the first side of the second cell is aligned with a center of the first active region in the first direction, the first rail overlaps the first side of the second cell and the center of the first active region, and a height of the first cell is different from a height of the second cell.
 8. The integrated circuit structure of claim 7, further comprising: a third rail configured to supply the second supply voltage, extending in the first direction, overlapping the second side of the second cell, and being located at the third level.
 9. The integrated circuit structure of claim 1, wherein the first cell further comprises: a set of vias over the first gate structure.
 10. The integrated circuit structure of claim 1, further comprising: a shallow trench isolation (STI) structure separating the first active region from the second active region.
 11. A method of fabricating an integrated circuit, the method comprising: placing a first standard cell layout on a layout, the placing the first standard cell layout comprising: placing a first active region pattern on a first layout level, the first active region pattern corresponding to fabricating a first active region of the integrated circuit, the first active region pattern extending in a first direction; and placing a second active region pattern on the first layout level, the second active region pattern corresponding to fabricating a second active region of the integrated circuit, the second active region pattern extending in the first direction and being separated from the first active region pattern in a second direction different from the first direction; placing a first power rail pattern on a second layout level different from the first layout level, the first power rail pattern corresponding to fabricating a first power rail of the integrated circuit, the first power rail being configured to supply a first supply voltage, the first power rail pattern extending in the first direction and overlapping a middle portion of the first active region pattern; and placing a second power rail pattern on the second layout level, the second power rail pattern corresponding to fabricating a second power rail of the integrated circuit, the second power rail being configured to supply a second supply voltage, the second power rail pattern extending in the first direction and overlapping a middle portion of the second active region pattern; and wherein at least one of the above patterns is stored on a non-transitory computer-readable medium, and at least one of the above operations is performed by a hardware processor; and manufacturing the integrated circuit based on at least one of the above patterns of the integrated circuit.
 12. The method of claim 11, further comprising: placing a second standard cell layout on the layout level, and being adjacent to the first standard cell layout, the second standard cell layout having a height different from a height of the first standard cell layout, the placing the second standard cell layout comprising: placing a third active region pattern on the first layout level, the third active region pattern corresponding to fabricating a third active region of the integrated circuit, the third active region pattern extending in the first direction; and placing a fourth active region pattern on the first layout level, the fourth active region pattern corresponding to fabricating a fourth active region of the integrated circuit, the fourth active region pattern extending in the first direction, and being separated from the third active region pattern in the second direction, wherein a first side of the second standard cell layout is aligned with a center of the first active region pattern in the first direction, and the first power rail pattern overlaps the first side of the second standard cell layout and the center of the first active region pattern.
 13. The method of claim 12, wherein the placing the second standard cell layout further comprises: placing a third power rail pattern on the second layout level, the third power rail pattern corresponding to fabricating a third rail of the integrated circuit, the third power rail pattern extending in the first direction, the third rail being configured to supply the second supply voltage, wherein the third power rail pattern overlaps a second side of the second standard cell layout, the second side of the second standard cell layout being an opposite side of the second standard cell layout from the first side of the second standard cell layout.
 14. The method of claim 11, wherein the placing the first standard cell layout further comprises: placing a first dummy gate pattern over a first edge of the first standard cell layout, the first dummy gate pattern corresponding to fabricating a first dummy gate structure of the integrated circuit, the first dummy gate pattern extending in the second direction and being on a third layout level different from the first layout level and the second layout level; and placing a second dummy gate pattern over a second edge of the first standard cell layout, the second dummy gate pattern corresponding to fabricating a second dummy gate structure of the integrated circuit, the second dummy gate pattern extending in the second direction and being on the third layout level.
 15. The method of claim 11, wherein the placing the first standard cell layout further comprises: placing a first gate pattern on a third layout level different from the first layout level and the second layout level, the first gate pattern corresponding to fabricating a first gate structure of the integrated circuit, the first gate pattern extending in the second direction, and overlapping the first active region pattern and the second active region pattern.
 16. The method of claim 15, wherein the placing the first standard cell layout further comprises: placing a set of fin patterns above the first active region pattern or the second active region pattern, the set of fin patterns corresponding to fabricating a set of fins of the integrated circuit, the set of fin patterns extending in the first direction and being below the first gate pattern, each fin pattern of the set of fin patterns being separated from an adjacent fin pattern of the set of fin patterns in the second direction by a fin pitch.
 17. The method of claim 11, wherein the placing the first standard cell layout further comprises: placing a shallow trench isolation (STI) pattern between the first active region pattern and the second active region pattern, the STI pattern corresponding to fabricating a STI structure of the integrated circuit.
 18. A method of forming an integrated circuit, the method comprising: generating a first standard cell layout, the first standard cell layout comprising a first side and a second side on an opposite side of the first standard cell layout from the first side, the generating the first standard cell layout comprising: generating a first active region pattern corresponding to fabricating a first active region of the integrated circuit, the first active region pattern extending in a first direction, and being located on a first layout level; generating a second active region pattern corresponding to fabricating a second active region of the integrated circuit the second active region pattern extending in the first direction and being located on the first layout level, and being separated from the first active region pattern in a second direction different from the first direction; generating a shallow trench isolation (STI) pattern corresponding to fabricating a STI structure of the integrated circuit, the STI pattern being between the first active region pattern and the second active region pattern; and generating a first gate pattern corresponding to fabricating a first gate structure of the integrated circuit, the first gate pattern extending in the second direction, overlapping the first active region pattern and the second active region pattern, and being located on a second layout level different from the first layout level; generating a first power rail pattern corresponding to fabricating a first power rail of the integrated circuit, the first power rail pattern extending in the first direction, overlapping the first active region pattern, and being located on a third layout level different from the first layout level and the second layout level, the first power rail being configured to supply a first supply voltage; and generating a second power rail pattern corresponding to fabricating a second power rail of the integrated circuit, the second power rail being configured to supply a second supply voltage different from the first supply voltage, the second power rail pattern extending in the first direction, being located on the third layout level, and being separated from the first power rail pattern in the second direction, wherein at least one of the above patterns is stored on a non-transitory computer-readable medium, and at least one of the above operations is performed by a hardware processor; and manufacturing the integrated circuit based on at least one of the above patterns of the integrated circuit.
 19. The method of claim 18, wherein the generating the first standard cell layout further comprises: generating a set of fin patterns corresponding to fabricating a set of fins of the integrated circuit, the set of fin patterns extending in the first direction and below the first gate pattern, each fin pattern of the set of fin patterns being separated from an adjacent fin pattern of the set of fin patterns in the second direction by a fin pitch; and generating a set of via patterns corresponding to fabricating a set of vias of the integrated circuit, the set of via patterns being over the first gate pattern, the set of vias being coupled to the first gate structure.
 20. The method of claim 18, wherein the generating the first standard cell layout further comprises: generating a first dummy gate pattern corresponding to fabricating a first dummy gate structure of the integrated circuit, the first dummy gate pattern extending in the second direction, being located on the second layout level, and overlapping a third side of the first standard cell layout; and generating a second dummy gate pattern corresponding to fabricating a second dummy gate structure of the integrated circuit, the second dummy gate pattern extending in the second direction, being located on the second layout level, and overlapping a fourth side of the first standard cell layout, the fourth side of the first standard cell layout being an opposite side of the first standard cell layout from the third side of the first standard cell layout. 